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Process Development Engineer

In this role you will:  Develop new backend processes for package assembly technologies. Bring package Innovation to the RF power packaging portfolio and contribute to the packaging roadmap for the Wolfspeed RF Power Division Define and optimize of critical process parameters and validate their reliability Design new customized tooling to adopt off the shelf equipment (Datacon EVO, Palomar) for our high volume production. Support Development for GaN/SiC on Copper substrates for high power RF power applications. Manage Development Milestone- and Feasibility Projects   You are best equipped for this job if you have the following profile:  BS,MS and PhD preferred in Mechanical, Chemical or Process Engineering or Applied Science 5+ years of experience in the field of Process engineering, Package or Process Development or in Product Engineering in a high technology Experience in high volume manufacturing, high power application and high RF power is preferred Project ManagementExperience is a plus Understanding of (Open Cavity) Packages for RF high power applications Experience with SMT Assembly is a plus Knowledge of DieAttach and Assembly equipment, Datacon, Esec, Palomar,... Ability to provide good quality results under pressure and in a timely manner. Highly motivated and must be able to work with minimum supervision. Good analytical and problem solving, interpersonal, and communication skills. Hands on experience on engineering methods such as FMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE. Good interpersonal skills to interface with customers and support groups within Infineon Business acumen to assess technical viability of solutions provided . Requisition ID 2018-6783
Salary Range: NA
Minimum Qualification
5 - 7 years

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