Packaging Engineer

Job Description We are seeking a Senior Engineer to join our Package and Process Technology Development Team for our RF Power Business. We are looking for an expert in organic (polymer) chemistry with a strong background in Package Design and Reliability   Experience with organic material selection for high power Packages Proficiency of Printed Circuit Board (PCB) materials and their limitations during high temp operation Experience with organic die attach materials like: Ag or Cu nano particle sintering pasts, conductive and nonconductive glues, epoxies and mold compounds. RF power packages and modules: experience with interconnects to mother board, coin/heat sink attach to PCB, Substrate based ovemold modules is desired. Expertise of mold compound chemistry with knowledge of its thermal limitations is a plus. Design and perform highly accelerated life tests to prove reliability (Arrhenius Equation...) Willingness to challenge internal & external design rules when applicable & achievable Contribute to package & process innovation for high power, RF packaging. Identify end-of-life failure mechanisms of organic materials (thermal & stress fatigue) Conduct intrinsic & extrinsic reliability testing for new product development   Requirements: Minimum MS, Prefer PhD in Organic Chemistry, Chemical Engineering, Materials Science & Engineering, Mechanical Engineering or related field 5+ yearexperience in Semiconductor Packaging using Organic Die Attach Materials and Mold Compounds Deep understanding of all topics in regards of (RF-)Power Packaging Strong interpersonal & communication skills Project management skills, capabilities and a positive project management track record scores you a huge plus. 2018-7105
Salary Range: NA
Minimum Qualification
8 - 10 years

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